| Copyright(c)AOTAKA 1995-2004 - www.aotaka.jp |
| 樹脂封止 パッケージ |
挿入形 | 1側面 | SIP (Single Inline Package) | ![]() |
| HSIP (SIP with Heat sink) | ||||
| ZIP (Zigzag Inline Package) | ||||
| 2側面 | DIP (Dual Inline Package) | |||
| SDIP (Shrink Dual Inline Package) | ||||
| 面実装形 | 2側面 | SOP (Small Outline Package) | ![]() |
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| SSOP (Shrink Small Outline Package) | ||||
| TSOP (Thin Small Outline Package) | ||||
| SOJ (Small Outline J-leaded Package) | ||||
| 4側面 | QFP (Quad Flat Package) | ![]() |
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| LQFP (Low profile Quad Flat Package) | ||||
| TQFP (Thin Quad Flat Package) | ||||
| QFJ (Quad Flat J-leaded Package) | ||||
| 面全体 | CSP (Chip Scale Package) | ![]() |
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| BGA パッケージ (Ball Grid Array) |
面実装形 | 面全体 | BGA Cavity Up Type | ![]() |
| BGA Cavity Down Type | ||||
| TCP パッケージ |
面実装形 | 2側面 | DTP (Dual Tape carrier Package) ※フィルム上に実装している |
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| 4側面 | QTP (Quad Tape carrier Package) ※フィルム上に実装している |